
Copper-Aluminum Thermal Block
Copper contact face with an aluminum body — thermal performance where it matters, without the weight and cost of solid copper.
Tolerances and finish confirmed against drawing; production follows sample approval.
Specifications
| Structure | Copper insert + aluminum body (press or braze) |
|---|---|
| Material | T2 copper / 6061-T6 |
| Surface finish | Nickel plating / mill finish |
| Design basis | Thermal simulation and drawing |
Copper conducts fast but is heavy and expensive; aluminum is light and cheaper but conducts less. The hybrid idea is to use copper only at the contact face.
How they are joined
Typically the copper insert is pressed or brazed into the aluminum body. Any void at the joint raises interface resistance, so surface roughness and joining pressure are controlled together.
Where it fits
High heat flux situations where solid copper is overkill. The structure should follow thermal simulation results — we do not recommend fixing copper thickness by rule of thumb.
Process notes
Separate machining of copper and aluminum, joint surface preparation, press or braze, flatness correction, optional nickel plating, joint sampling.
Applications
High power lasers, power modules, server cold plates, power electronics.
Downloads
Case studies


Products
CZ-HW-001
CZ-HW-002
CZ-HW-003