
IGBT Skived Fin Heat Sink
Large-footprint skived heat sink for IGBT and power modules, with a flat, thick base for thermal pad or grease assembly.
Tolerances and finish confirmed against drawing; production follows sample approval.
Specifications
| Alloy | 6063-T5 |
|---|---|
| Base thickness | 10-15 mm |
| Flatness | Per drawing (corrected after milling) |
| Fin pitch | 2-3 mm |
| Mounting holes | Custom to module footprint |
| Surface finish | Mill finish / anodizing |
An IGBT module concentrates heat in a small chip area. The base plate spreads it sideways before the fins move it into the air. Thicker, flatter bases spread heat more evenly and reduce the temperature difference across the module.
Why the base matters
For these parts we usually build the base to 10-15 mm and control flatness after milling. The mounting face is machined to suit the thermal interface material specified by the customer, so no gap opens up after assembly.
Assembly notes
Keep fin channels aligned with the airflow. Tighten the module to the torque specified by the customer — over-torquing a thin base bows it and raises contact resistance.
Process notes
Billet cutting, CNC skiving, base milling and flatness correction, drilling and tapping, deburring and cleaning, surface finishing, flatness sampling before shipment.
Applications
IGBT modules, variable frequency drives, welding machines, EV charger power units, motor controllers.
Downloads
Case studies



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